Static Random Access Memory (SRAM) Cell and Method for Forming Same

ABSTRACT

An embodiment is a method for forming a static random access memory (SRAM) cell. The method comprises forming transistors on a semiconductor substrate and forming a first linear intra-cell connection and a second linear intra-cell connection. Longitudinal axes of the active areas of the transistors are parallel. A first pull-down transistor and a first pull-up transistor share a first common gate structure, and a second pull-down transistor and a second pull-up transistor share a second common gate structure. The first linear intra-cell connection electrically couples active areas of the first pull-down transistor and the first pull-up transistor to the second common gate structure. The second linear intra-cell connection electrically couples active areas of the second pull-down transistor and the second pull-up transistor to the first common gate structure.

This application is a divisional of U.S. patent application Ser. No. 12/408,193, filed on Mar. 20, 2009, entitled “Static Random Access Memory (SRAM) Cell and Method for Forming Same,” which application is hereby incorporated herein by reference in its entirety.

TECHNICAL FIELD

The present invention relates generally to semiconductor devices and, more particularly, to a static random access memory (SRAM) cell and a method for creating a SRAM cell.

BACKGROUND

Static Random Access Memory (SRAM) is chosen as a reliable, proven technology for high-performance stand-alone memory devices or embedded memory devices. The distinct advantages of an SRAM include fast access speed, low power consumption, high noise margin, and process compatibility with a conventional CMOS fabrication process, among others. However, the size of the SRAM cell is limited by problems encountered in processing. This prevents the use of SRAM in devices that require very small SRAM cells. Further, processing requirements of conventional SRAM cells hinder the use of fin field effect transistors (FinFETs) in the SRAM. Thus, there is a need for a layout of an SRAM cell that obviates processing problems for small cell sizes and allows for the application of FinFETs in SRAM.

A conventional 6T SRAM layout may be used in 90 nm, 65 nm, 45 nm, and 32 nm technology, but problems occur that can prevent using the layout for smaller technology. For instance, as the cell size becomes smaller, the individual components, such as the active areas of the transistors, the intra-cell connections, and contacts, would naturally need to become smaller. Unfortunately, current lithography and etching techniques limit the size of individual components. Hence, once the individual components decrease to the smallest possible size, if the cell size continues to decrease, the components will cause a greater density within the cell and may overlay other components. Any overlay would lead to a short circuit between different components causing device failure.

Generally, a 6T SRAM cell comprises two pass-gate transistors, two pull-down transistors, and two pull-up transistors. Each pass-gate transistor typically shares a source/drain region with one of the pull-down transistors. Due to the layout and the desired electrical characteristics of the pass-gate transistor and the pull-down transistor, the active area is frequently non-rectangular such that an active zag is created between the active areas of the pass-gate transistor and the pull-down transistor where the active area changes direction or widths. These active zags generally create problems with current mismatch between the pull-down and pull-up transistors and leakage current between the pass-gate and pull-down transistors. The problems generally arise because of weaknesses in processing sharp corners, such as those of the active zag. Also, a strong electric field around the corner may cause leakage problems.

In the conventional layout, the active areas of the pass-gate and pull-down transistors usually adjoin such that the lengths of the active areas of the transistors largely define a dimension of the cell layout. Further, a single contact is usually formed to the active areas of those transistors between each transistor's gate. As a result, if the contact cannot be etched any smaller, the contact may also be a limiting factor; otherwise, overlay of the contact with the gate electrode spacers may result and adversely affect performance. Thus, any limitation on the size of the contact or spacers can further define the dimension of the cell layout. The length of this dimension can result in long bitlines that can increase line capacitance and can slow the performance of the SRAM cell.

The conventional layout also usually includes a butted contact wherein the butted contact electrically couples a metal on a first metallization layer to a gate of the pull-down transistor and the pull-up transistor. These butted contacts generally require multiple etching steps because the components that are to be contacted are at different depths. The multiple etching steps may generally create more costs in processing and may cause more processing control problems.

Furthermore, the conventional layout also is not generally compatible with the process for building FinFETs. Generally FinFETs and tri-gate transistors need to be the same width in SRAM cells, but by making the transistors the same width in the conventional layout, SRAM issues, such as instability of the SRAM due to a beta-ratio that is too low, may arise.

Accordingly, there is a need for a SRAM layout that overcomes these deficiencies of the prior art. Embodiments of the invention seek to solve or obviate the limitations and problems of conventional SRAM layouts, as generally discussed above, and gain further advantages discussed herein.

SUMMARY OF THE INVENTION

These and other problems are generally solved or circumvented, and technical advantages are generally achieved, by embodiments.

An embodiment is a method for forming a static random access memory (SRAM) cell. The method comprises forming transistors on a semiconductor substrate and forming a first linear intra-cell connection and a second linear intra-cell connection. The transistors have active areas such that longitudinal axes of the active areas are parallel. The transistors include a first pull-down transistor, a first pull-up transistor, a second pull-down transistor, and a second pull-up transistor. The first pull-down transistor and the first pull-up transistor share a first common gate structure, and the second pull-down transistor and the second pull-up transistor share a second common gate structure. The first linear intra-cell connection electrically couples active areas of the first pull-down transistor and the first pull-up transistor to the second common gate structure. The first linear intra-cell connection has a first cross-sectional area parallel to a top surface of the semiconductor substrate, and all outer edges of the first cross-sectional area form a rectangle. The second linear intra-cell connection electrically couples active areas of the second pull-down transistor and the second pull-up transistor to the first common gate structure. The second linear intra-cell connection has a second cross-sectional area parallel to the top surface of the semiconductor substrate, and all outer edges of the second cross-sectional area form a rectangle.

Another embodiment is a method for forming a semiconductor structure. The method comprises forming a first active area, a second active area, a third active area, a fourth active area, a fifth active area, and a sixth active area of a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, and a sixth transistor, respectively, in a substrate; and forming a first gate, a second gate, a third gate, a fourth gate, a fifth gate, and a sixth gate of the first transistor, the second transistor, the third transistor, the fourth transistor, the fifth transistor, and the sixth transistor, respectively, on the substrate. Longitudinal axes of the active areas are parallel. The first gate, the second gate, the third gate, a fourth source/drain region of the fourth active area, a fifth source/drain region of the fifth active area, a sixth source/drain region of the sixth active area are all aligned, and the fourth gate, the fifth gate, the sixth gate, a first source/drain region of the first active area, a second source/drain region of the second active area, a third source/drain region of the third active area are all aligned.

A further embodiment is a method for forming a semiconductor structure. The method comprises forming respective active areas of a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, and a sixth transistor; forming source/drain regions in each of the active areas; and forming respective gates of the first transistor, the second transistor, the third transistor, the fourth transistor, the fifth transistor, and the sixth transistor. The active areas are formed in a substrate. A first aligned group of one of the source/drain regions of the first transistor, one of the source/drain regions of the second transistor, and one of the source/drain regions of the third transistor all align. A second aligned group of one of the source/drain regions of the fourth transistor, one of the source/drain regions of the fifth transistor, and one of the source/drain regions of the sixth transistor all align. The gate of the second transistor and the gate of the third transistor align with the second aligned group, and the gate of the fourth transistor and the gate of the fifth transistor align with the first aligned group

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawing, in which:

FIG. 1A is a layout of a 6T SRAM cell in accordance with an embodiment of the invention;

FIG. 1B is a first metallization layer for the layout of the 6T SRAM cell in accordance with an embodiment of the invention;

FIG. 2 is a four memory cell layout in accordance with an embodiment of the invention;

FIG. 3 is a thirty-two memory cell layout in accordance with another embodiment;

FIG. 4 is a flow chart of a process to form a memory cell in accordance with an embodiment of the invention; and

FIG. 5 is a layout of a dual port SRAM cell in accordance with another embodiment of the invention.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

The making and using of the present embodiments are discussed in detail below. It should be appreciated, however, that the present invention provides many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are merely illustrative of specific ways to make and use the invention, and do not limit the scope of the invention.

The present invention will be described with respect to embodiments in a specific context, namely a 6T SRAM layout and a dual port SRAM layout. The invention may also be applied, however, to any kind of SRAM cell layout, including 10T SRAM layouts.

FIG. 1A shows a layout of a 6T SRAM cell 100 in accordance with embodiments of the invention. The memory cell layout 100 comprises a first pass-gate transistor PG-1, a second pass-gate transistor PG-2, a first pull-down transistor PD-1, a second pull-down transistor PD-2, a first pull-up transistor PU-1, and a second pull-up transistor PU-2 disposed in a semiconductor substrate.

The longitudinal axes of the active areas of the transistors are all parallel such that the direction of current flow when the transistors are operating is parallel. Further, the active areas of the first pass-gate transistor PG-1, the first pull-down transistor PD-1, and the first pull-up transistor PU-1 align with the second pull-up transistor PU-2 polysilicon gate 116 and the second pull-down transistor PD-2 polysilicon gate 118 such that a linear intra-cell connection 122 electrically couples the active areas of the first pass-gate transistor PG-1, the first pull-down transistor PD-1, and the first pull-up transistor PU-1 to the second pull-up transistor PU-2 polysilicon gate 116 and the second pull-down transistor PD-2 polysilicon gate 118 Likewise, the active areas of the second pass-gate transistor PG-2, the second pull-down transistor PD-2, and the second pull-up transistor PU-2 align with the first pull-up transistor PU-1 polysilicon gate 110 and the first pull-down transistor PD-1 polysilicon gate 112 allowing a linear intra-cell connection 124 to electrically couple the active areas of the second pass-gate transistor PG-2, the second pull-down transistor PD-2, and the second pull-up transistor PU-2 to the first pull-up transistor PU-1 polysilicon gate 110 and the first pull-down transistor PD-1 polysilicon gate 112.

The linear intra-cell connections 122 and 124 are located below the first metallization layer, e.g., on a metal 0 layer on the semiconductor substrate. The linear intra-cell connections 122 and 124 may electrically couple the respective polysilicon gates by physically adjoining or overlapping the respective polysilicon gates. In FIG. 1A, a single, continuous portion of polysilicon is the second pull-up transistor PU-2 polysilicon gate 116 and the second pull-down transistor PD-2 polysilicon gate 118. The linear intra-cell connection 122 may electrically couple these gates by physically adjoining or overlapping the single, continuous portion of polysilicon. Because of this coupling, no other contact is needed to connect the second pull-up transistor PU-2 polysilicon gate 116 and the second pull-down transistor PD-2 polysilicon gate 118 to the linear intra-cell connection 122. The linear intra-cell connection 124, the first pull-up transistor PU-1 polysilicon gate 110, and the first pull-down transistor PD-1 polysilicon gate 112 may likewise be formed. Persons having ordinary skill in the art will realize that metal, polysilicon, a silicide, or other conductive materials may be used to form the linear intra-cell connections and polysilicon gates.

The transistors are also electrically coupled to a metallization layer that overlays the SRAM cell 100. FIG. 1B is an exemplary first metallization layer that overlays the SRAM cell 100 in accordance with an embodiment. The active area of the first pull-up transistor PU-1 is further electrically coupled by contact 126 (see FIG. 1A) to V_(dd) trace 186. The active area of the first pull-down transistor PD-1 is electrically coupled by contact 128 (see FIG. 1A) to V_(ss) trace 184. The active area of the first pass-gate transistor PG-1 is electrically coupled by contact 130 (see FIG. 1A) to bitline (BL) trace 182. The first pass-gate transistor PG-1 polysilicon gate 114 is electrically coupled by contact 132 (see FIG. 1A) to wordline (WL) pad 180.

The active area of the second pull-up transistor PU-2 is further electrically coupled by contact 134 (see FIG. 1A) to V_(dd) trace 186. The active area of the second pull-down transistor PD-2 is electrically coupled by contact 136 (see FIG. 1A) to V_(ss) trace 188. The active area of the second pass-gate transistor PG-2 is electrically coupled by contact 138 (see FIG. 1A) to complementary-BL (BLB) trace 190. The second pass-gate transistor PG-2 polysilicon gate 120 is electrically coupled by contact 140 (see FIG. 1A) to WL pad 192. Each trace and pad on the first metallization layer may be linear as illustrated in the embodiment in FIG. 1B, even though V_(dd) trace 186 is not illustrated as linear.

Wordline traces are on a second metallization layer (not shown) overlaying the first metallization layer such that the second metallization layer is separated from the first metallization layer by a dielectric layer or other equivalent layers in an interconnect structure. The wordline traces electrically couple the WL pads 180 and 192 through vias in the dielectric layer or interconnect structure. A person having ordinary skill in the art will know that the wordline traces generally run perpendicular to the BL trace 182 and the BLB trace 190 such that the wordline traces are typically on a different metal layer than the BL trace 182 and the BLB trace 190. Otherwise, the traces herein discussed do not necessarily have to be on these layers and may be on any layer. For example, wordline traces may be on the first metallization layer along with BL and BLB pads such that the BL and BLB traces are on the second metallization layer and are electrically coupled to the BL and BLB pads. Also, the V_(dd) trace 186 and the V_(ss) traces 184 and 188 may be on any metallization layer without limitation.

The structure in FIG. 1A defines a unit or memory cell 150, as illustrated by the dotted line. The unit cell 150 defines the basic building block for designing memory cells and may be duplicated to create larger memories.

With the layout in FIG. 1A, many of the problems faced by the conventional layout are solved, or the impacts of the problems are decreased. First, the linear intra-cell connections 122 and 124 are not surrounded by other components in the cell so overlay is not as much of a problem and density is reduced. Further, each component extends in only one direction without any bends, i.e., unidirectional or linear, that makes processing control better. This allows for the layout to be used in 22 nm technology and smaller. Also, there is no need for a butted contact so processing is easier and requires fewer steps. Next, there is no active zag in the active areas of the transistors because each transistor active area is isolated and connected only with an intra-cell connection. Thus, leakage and current mismatch is less of a problem. Next, the y-dimension of the cell is no longer defined by two transistor lengths, but by one. This allows cells in a matrix to be denser in the y-direction to decrease the bitline distance and capacitance and increase the overall SRAM speed. Further, in the layout in FIG. 1A, the pass-gate and pull-down transistors may be made with differing widths, making the layout more compatible with FinFETs and tri-gate transistors because the zag in the active area is removed, which is preferred for FinFET processes such as Fin define, the dielectric and metal gate removal from the Fin sidewall, and Fin gap-fill.

Further advantages of the layout in FIG. 1A may be realized. First, one metal layer is saved. By placing the linear intra-cell connections 122 and 124 on the semiconductor substrate, a metal layer and the relevant contacts are unnecessary. Next, NMOS transistors are enhanced. An NMOS transistor is enhanced because a shallow trench isolation (STI) adjoining the transistor is shortened. In the conventional layout, the active areas of the pass-gate and pull-down transistors are connected, and a STI will continuously run along the side of the pass-gate and pull-down transistor active areas. In the layout in FIG. 1A, no two active areas are physically connected, and a STI will only run alongside a single transistor active area. Thus, the STI is shortened, thereby reducing the stress on the STI and enhancing the NMOS transistor. Additionally, in the layout in FIG. 1A, the pass-gate and pull-down transistors may be doped and tuned independently of each other because the transistor active areas are isolated. In the conventional layout, the pass-gate and pull-down transistor active areas abutted each other thus making separate tuning difficult. Even further, the processing for the polysilicon gate layer is more efficient and easier. The polysilicon gate is continuous in FIG. 1A making lithography and etch processes much easier.

FIG. 2 shows a four memory cell 100 layout in accordance with an embodiment of the invention. FIG. 3 shows a thirty-two memory cell 100 layout in accordance with another embodiment. In each figure, the dashed lines mark the boundaries of each cell. For any particular memory cell, the layouts of the four memory cells adjoining a boundary of the particular memory cell are mirrored, flipped, inverted, or rotated around the boundary with respect to the particular memory cell layout. This allows the active areas or gates of the transistors along the boundary to share mutual contacts to traces on the metal layers discussed with regard to FIG. 1B.

FIG. 4 is a flow chart of a process to build a memory cell in accordance with an embodiment of the invention. While the process is described in accordance with an embodiment, the steps of the process may be performed in other orders, and the order discussed with reference to FIG. 4 does not limit any order of the steps described.

Step 400 is forming the transistor active areas in a semiconductor substrate. This step may comprise forming STIs around each transistor active area. Also, the active areas may be doped with the appropriate n-type or p-type dopants to create n-wells or p-wells for PMOS or NMOS transistors, respectively. Processing may require forming and patterning resist layers in order to form the STIs and the n-wells and p-wells as is known in the art. Alternatively, if FinFETs are to be formed, this step may comprise forming STIs and etching and doping the semiconductor substrate to form the FinFET active areas.

The longitudinal axis of each active area is formed parallel to the longitudinal axis of the other active areas. The longitudinal axis is in the same direction as the flow of current through the active areas when each active area is operating. Active areas for a first half of the memory cell's transistors (e.g., the first pass-gate transistor PG-1, the first pull-down transistor PD-1, and the first pull-up transistor PU-1 of FIG. 1A) are formed such that an axis that is perpendicular to the longitudinal axes of the active areas intersects each of the active areas of the first half. Likewise, active areas for a second half of the memory cell's transistors (e.g., the second pass-gate transistor PG-2, the second pull-down transistor PD-2, and the second pull-up transistor PU-2 of FIG. 1A) are formed. As described in greater detail below, this arrangement of the active areas allows for linear intraconnections to be formed overlying the source/drain regions.

Further, the active areas of the first half and the active areas of the second half are positioned with regard to the respective halves such that a linear intra-cell connection may be later formed electrically coupling the active areas of the first half to gate structures of some of the transistors of the second half and such that another linear intra-cell connection may be formed electrically coupling the active areas of the second have to gate structures of some of the transistors of the first half. For example in FIG. 1A, linear intra-cell connection 122 electrically couples the active areas of the first pass-gate transistor PG-1, the first pull-down transistor PD-1, and the first pull-up transistor PU-1 to the second pull-up transistor PU-2 polysilicon gate 116 and the second pull-down transistor PD-2 polysilicon gate 118, and linear intra-cell connection 124 electrically couples the active areas of the second pass-gate transistor PG-2, the second pull-down transistor PD-2, and the second pull-up transistor PU-2 to the first pull-up transistor PU-1 polysilicon gate 110 and the first pull-down transistor PD-1 polysilicon gate 112.

Step 410 is forming the transistor gate structures. This step may include forming a dielectric layer, possibly silicon dioxide, over the semiconductor substrate. Then a gate electrode layer is formed over the dielectric layer. This gate electrode layer may be polysilicon or metal. If polysilicon is used, in subsequent steps the gate electrode may be reacted with metal to form a silicide to reduce contact resistance. The dielectric layer and the gate electrode layer are then etched such that the layers remain only on the active areas to form gate electrodes. Similarly, if FinFETs are used, the gate structures will be formed over and around the transistor active areas.

Two transistors of the first half that are to be pull-down and pull-up transistors may have gates formed of a single piece of the gate electrode layer, though this is not necessary; the two transistors of the second half that are to be pull-down and pull-up transistors may be formed likewise. Also, dielectric spacers may be formed along the edges of the gate electrodes, and the gate electrodes may be doped as desired.

Step 420 is forming the source and drain regions of the transistors. This may involve doping the active areas on either side of the gate for each transistor. Different resist layers may be needed when doping transistors with p-type dopants and when doping transistors with n-type dopants.

Step 430 is forming the linear intra-cell connection. This may include forming a metal layer over the semiconductor substrate, patterning a resist layer over the metal, and etching away excess metal material that will not be formed into the linear intra-cell connection. Alternatively, a damascene process may be used to form the linear intra-cell connection. The metal electrically couples the active areas of a pass-gate transistor, a pull-down transistor, and a pull-up transistor to the gate structures of another pull-up transistor and pull-down transistor. Further, the metal may overlay portions of the gate electrode. Alternatively, polysilicon may be used instead of metal, and further, the polysilicon can be reacted with metal to form a metal silicide.

Step 440 is forming a first metallization layer. This may include a damascene or dual damascene process where a dielectric layer is formed over the memory cell and etched to form openings that will become contacts to the active areas or gates of the transistors and traces and pads of the first metallization layer, such as traces for V_(dd), V_(ss), bitline, and complementary bitline and pads for wordline. Then, a metal may be deposited into the openings to form the traces, pads, and contacts. Any excess metal may be removed, such as by a CMP process. This step may electrically couple the active areas of the transistors to the traces for V_(dd), V_(ss), bitline, and complementary bitline as appropriate and may couple wordline pads to the gates of the pass-gate transistors.

Step 450 is forming a second metallization layer. This may include a damascene or dual damascene process where a dielectric layer is formed over the memory cell and etched to form openings for vias and traces. The openings for the vias may be etched down to the pads of the first metallization layer. Then, a metal may be deposited into the openings to form the vias and traces. Any excess metal may be removed, such as by a CMP process. This step may electrically couple the gates of the pass-gate transistors to wordline traces.

FIG. 5 illustrates a dual port SRAM memory cell 500 in accordance with another embodiment of the present invention. The memory cell 500 comprises a first read pass-gate transistor PG-1A′, a first write pass-gate transistor PG-1B′, a second read pass-gate transistor PG-2A′, a second write pass-gate transistor PG-2B′, a first pull-down transistor PD-1′, a second pull-down transistor PD-2′, a first pull-up transistor PU-1′, and a second pull-up transistor PU-2′ disposed in a semiconductor substrate.

The longitudinal axes of the active areas of the transistors are all parallel such that the direction of current flow when the transistors are operating is parallel. Further, the active areas of the first read pass-gate transistor PG-1A′, the first write pass-gate transistor PG-1B′, the first pull-down transistor PD-1′, and the first pull-up transistor PU-1′ align with the second pull-up transistor PU-2′ polysilicon gate 518 and the second pull-down transistor PD-2′ polysilicon gate 520 such that a linear intra-cell connection 526 electrically couples the active areas of the first read pass-gate transistor PG-1A′, the first write pass-gate transistor PG-1B′, the first pull-down transistor PD-1′, and the first pull-up transistor PU-1′ to the second pull-up transistor PU-2′ polysilicon gate 518 and the second pull-down transistor PD-2′ polysilicon gate 520 Likewise, the active areas of the second read pass-gate transistor PG-2A′, the second write pass-gate transistor PG-2B′, the second pull-down transistor PD-2′, and the second pull-up transistor PU-2′ align with the first pull-up transistor PU-1′ polysilicon gate 510 and the first pull-down transistor PD-1′ polysilicon gate 512 allowing a linear intra-cell connection 528 to electrically couple the active areas of the second read pass-gate transistor PG-2A′, the second write pass-gate transistor PG-2B′, the second pull-down transistor PD-2′, and the second pull-up transistor PU-2′ to the first pull-up transistor PU-1′ polysilicon gate 510 and the first pull-down transistor PD-1′ polysilicon gate 512.

The linear intra-cell connections 526 and 528 are located below the first metallization layer, e.g., on a metal 0 layer on the semiconductor substrate Like with linear intra-cell connections 122 and 124 in FIG. 1A, the linear intra-cell connections 526 and 528 are on the semiconductor substrate like the polysilicon gates such that no other contact is needed to connect the gates to the linear intra-cell connections. Persons having ordinary skill in the art will realize that metal, polysilicon, a silicide, or other conductive materials may be used to form the linear intra-cell connections and polysilicon gates. The above structure defines a unit or memory cell 560, as illustrated by the dotted line.

The transistors are also electrically coupled to a first metallization layer overlaying the memory cell 500 through various contacts. The first metallization layer may be similar to the metallization layer depicted in FIG. 1B or the various alternatives described with respect to FIG. 1B. However, at least two additional pads and/or traces would be required on the first metallization layer to accommodate the additional wordlines and bitlines.

In one embodiment, the active area of the first pull-up transistor PU-1′ is further electrically coupled by contact 530 to a V_(dd) trace. The active area of the first pull-down transistor PD-1′ is electrically coupled by contact 532 to a V_(ss) trace. The active area of the first write pass-gate transistor PG-1B′ is electrically coupled by contact 534 to a write bitline (BBL) trace. The first write pass-gate transistor PG-1B′ polysilicon gate 514 is electrically coupled by contact 536 to a write wordline (WL-2) pad. The active area of the first read pass-gate transistor PG-1A′ is electrically coupled by contact 538 to a read bitline (ABL) trace. The first read pass-gate transistor PG-1A′ polysilicon gate 516 is electrically coupled by contact 540 to a read wordline (WL-1) pad.

The active area of the second pull-up transistor PU-2′ is further electrically coupled by contact 542 to the V_(dd) trace. The active area of the second pull-down transistor PD-2′ is electrically coupled by contact 544 to another V_(ss) trace. The active area of the second write pass-gate transistor PG-2B′ is electrically coupled by contact 546 to a complementary-BBL trace. The second write pass-gate transistor PG-2B′ polysilicon gate 522 is electrically coupled by contact 548 to another WL-2 pad. The active area of the second read pass-gate transistor PG-2A′ is electrically coupled by contact 550 to a complementary-ABL trace. The second read pass-gate transistor PG-2A′ polysilicon gate 524 is electrically coupled by contact 552 to another WL-1 pad.

Similar to FIG. 1B, in the embodiment illustrated by FIG. 5, read and write wordline traces are on a second metallization layer overlaying the first metallization layer such that the second metallization layer is separated from the first metallization layer by a dielectric layer or other equivalent layers in an interconnect structure. The read wordline traces electrically couple the WL-1 pads through vias in the dielectric layer or interconnect structure, and the write wordline traces electrically couple the WL-2 pads in a similar manner. The traces herein discussed do not necessarily have to be on these layers and may be on any layer.

Although the present invention and its advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims. Particularly, the positioning and/or alignment of the respective components of the SRAM cells described above do not have to be exactly positioned, aligned, or sized as depicted in the figures. For example, a person having ordinary skill in the art will know that variations from processing semiconductor devices may prevent exact alignment, and as such, small variations are considered within the scope of the present invention.

Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the disclosure of the present invention, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the present invention. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps. 

1. A method for forming a static random access memory (SRAM) cell, the method comprising: forming transistors on a semiconductor substrate, the transistors having active areas such that longitudinal axes of the active areas are parallel, the transistors including a first pull-down transistor, a first pull-up transistor, a second pull-down transistor, and a second pull-up transistor, wherein the first pull-down transistor and the first pull-up transistor share a first common gate structure, and wherein the second pull-down transistor and the second pull-up transistor share a second common gate structure; and forming a first linear intra-cell connection and a second linear intra-cell connection, wherein the first linear intra-cell connection electrically couples active areas of the first pull-down transistor and the first pull-up transistor to the second common gate structure, the first linear intra-cell connection having a first cross-sectional area parallel to a top surface of the semiconductor substrate, all outer edges of the first cross-sectional area forming a rectangle, and wherein the second linear intra-cell connection electrically couples active areas of the second pull-down transistor and the second pull-up transistor to the first common gate structure, the second linear intra-cell connection having a second cross-sectional area parallel to the top surface of the semiconductor substrate, all outer edges of the second cross-sectional area forming a rectangle.
 2. The method of claim 1, wherein the forming the first linear intra-cell connection and the second linear intra-cell connection comprises forming the first linear intra-cell connection and the second linear intra-cell connection on the semiconductor substrate.
 3. The method of claim 1 further comprising: forming a first metallization layer comprising first layer traces, wherein each of the first layer traces is electrically coupled to at least one of the active areas; and forming a second metallization layer comprising second layer traces, wherein each of the second layer traces is electrically coupled to a gate structure of a first pass-gate transistor or a gate structure of a second pass-gate transistor.
 4. The method of claim 3, wherein some of the first layer traces are linear, and wherein the second layer traces are linear.
 5. The method of claim 1, wherein the first linear intra-cell connection and the second linear intra-cell connection each comprises a metal, polysilicon, or a silicide.
 6. The method of claim 1, wherein the forming the transistors comprises forming fin field effect transistors.
 7. The method of claim 1, wherein none of the active areas has a longitudinal axis that is co-linear with another longitudinal axis of another of the active areas.
 8. A method for forming a semiconductor structure, the method comprising: forming a first active area, a second active area, a third active area, a fourth active area, a fifth active area, and a sixth active area of a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, and a sixth transistor, respectively, in a substrate, longitudinal axes of the active areas being parallel; and forming a first gate, a second gate, a third gate, a fourth gate, a fifth gate, and a sixth gate of the first transistor, the second transistor, the third transistor, the fourth transistor, the fifth transistor, and the sixth transistor, respectively, on the substrate, the first gate, the second gate, the third gate, a fourth source/drain region of the fourth active area, a fifth source/drain region of the fifth active area, a sixth source/drain region of the sixth active area being all aligned, the fourth gate, the fifth gate, the sixth gate, a first source/drain region of the first active area, a second source/drain region of the second active area, a third source/drain region of the third active area being all aligned.
 9. The method of claim 8 further comprising forming a first intra-cell connection and a second intra-cell connection, the first intra-cell connection electrically coupling the second gate, the third gate, the fourth source/drain region, the fifth source/drain region, and the sixth source/drain region, the second intra-cell connection electrically coupling the fourth gate, the fifth gate, the first source/drain region, the second source/drain region, and the third source/drain region.
 10. The method of claim 9, wherein each of the first intra-cell connection and the second intra-cell connection are formed on a top surface of the substrate and below a first metallization layer.
 11. The method of claim 9, wherein each of the first intra-cell connection and the second intra-cell connection has a cross-sectional area parallel to a top surface of the substrate, all outer edges of the cross-sectional area forming a rectangle.
 12. The method of claim 9, wherein a first longitudinal axis of the first intra-cell connection is aligned with the second gate and the third gate, and wherein a second longitudinal axis of the second intra-cell connection is aligned with the fourth gate and the fifth gate.
 13. The method of claim 8 further comprising: forming a first metallization layer comprising first layer traces, wherein each of the first layer traces is electrically coupled to at least one of the active areas; and forming a second metallization layer comprising second layer traces, wherein each of the second layer traces is electrically coupled to the first gate or the sixth gate.
 14. The method of claim 13, wherein some of the first layer traces are linear, and wherein the second layer traces are linear.
 15. A method for forming a semiconductor structure, the method comprising: forming respective active areas of a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, and a sixth transistor, the active areas being formed in a substrate; forming source/drain regions in each of the active areas, a first aligned group of one of the source/drain regions of the first transistor, one of the source/drain regions of the second transistor, and one of the source/drain regions of the third transistor all aligning, a second aligned group of one of the source/drain regions of the fourth transistor, one of the source/drain regions of the fifth transistor, and one of the source/drain regions of the sixth transistor all aligning; and forming respective gates of the first transistor, the second transistor, the third transistor, the fourth transistor, the fifth transistor, and the sixth transistor, the gate of the second transistor and the gate of the third transistor aligning with the second aligned group, the gate of the fourth transistor and the gate of the fifth transistor aligning with the first aligned group.
 16. The method of claim 15 further comprising forming a first cell connection and a second cell connection, the first cell connection electrically coupling the source/drain regions of the first aligned group with the gate of the fourth transistor and the gate of the fifth transistor, the second cell connection electrically coupling the source/drain regions of the second aligned group with the gate of the second transistor and the gate of the third transistor.
 17. The method of claim 16, wherein each of the first cell connection and the second cell connection are formed on a top surface of the substrate and below a first metallization layer.
 18. The method of claim 16, wherein each of the first cell connection and the second cell connection has a cross-sectional area parallel to a top surface of the substrate, all outer edges of the cross-sectional area forming a rectangle.
 19. The method of claim 16, wherein a first longitudinal axis of the first cell connection is aligned with the gate of the second transistor and the gate of the third transistor, and wherein a second longitudinal axis of the second cell connection is aligned with the gate of the fourth transistor and the gate of the fifth transistor.
 20. The method of claim 15 further comprising: forming a first metallization layer comprising first traces, wherein each of the first traces is electrically coupled to at least one of the active areas, wherein some of the first traces are linear; and forming a second metallization layer comprising second traces, wherein each of the second traces is electrically coupled to the gate of the first transistor or the gate of the sixth transistor. 